Small Footprint
G2
The G2 offers the reliability of VPC Interconnect technology in a compact high-density, two-module package. Simultaneously engaging a wide range of Interconnect options in multiple configurations, the G2 provides a rapid alternative to repeated connect/disconnect of individual leads and connectors in a rugged, reliable system.
G6
The G6 Module Solution provides versatility on a small footprint, six-module package. This small, high-density Interconnect can simultaneously engage up to 1,440 signal contacts. The adaptable G6 integrates a wide variety of I/O options in various module configurations. The contacts are incorporated into cable assemblies for specific instruments. The Vertical Hinged Mounting Frame is suitable for rack or chassis mount applications and offers quick access to resources and cables. The ITA has a unique, removable, EMI shielded cover which allows easy access to the modules and contacts.
G10
The G10 Module Solution provides great reliability while simultaneously engaging up to 2,400 signal contacts in a ten-module package. The adaptable G10 integrates a wide variety of I/O options in various module configurations. The contacts are incorporated into cable assemblies for specific instruments. The Vertical Hinged Mounting Frame is suitable for rack or chassis mount applications and offers quick access to resources and cables. The ITA has a unique, removable, EMI shielded cover which allows easy access to the modules and contacts.
